Packaging Engineer

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THE ROLE:

Being in External Manufacturing Operations (Backend Engineering), candidate is required to drive supplier engagement in external Flip Chip bumping/fan out/RDL/on substrate assembly manufacturer on delivering key performance indices in terms on yield, excursion free and enabling new capabilities.  

THE PERSON:

The successful candidates must have strong commitment to meeting deadlines/ lead & drive for solutions and an aptitude to thrive in a fast-paced multi-tasking environment. He or she would have excellent cross functional project management skill, conflict management skill, analytics & trouble shooting skill with strong interpersonal skills with good presentation skills. Good in writing and speaking in English.

KEY RESPONSIBILITIES:

• Drive for supplier engagement on continuous improvement and new capabilities ahead of need.
• Plan and drive for New Product Introduction activities and Ramp Up readiness.
• Drive external manufacturer on issue resolution and issue prevention with leading indicators to proactively identify risks
• Timely execution of special work requests, with comprehensive reports.
• Monitor performance of external manufacturing site regarding yield, out of control lots of disposition, and any outliers reporting from internal or external parties.
• Plan and execute change management from internal or external parties.
• Proactively identifies improvement opportunities and drives towards continuous improvement in process simplification and quality enhancement, be it in internal and external environments.
• Occasionally to support on site audit and travelling.
• May involve in regional supplier management.
• Assist in additional duties as deemed fit by supervisor.

PREFERRED EXPERIENCE:

• Strong knowledge in Bumping/fan out/RDL process (while Flip Chip assembly, advance package is added advantage)
• Proven experience in process development, qualification, and high-volume manufacturing within a semiconductor ASIC environment
• Familiar with tools (AI agents, JMP, minitab, failure analysis knowledge, package reliability knowledges) and industry standard (ESD, Jedec, Automotive).
• Good leadership and interpersonal relationship.
• Good English speaking, communication, and writing skills.

ACADEMIC CREDENTIALS:

• Bachelor/MS degree in Mechanical or Material or Chemical Engineering

LOCATION:

Hsinchu, Taiwan

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Benefits offered are described:  AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position.  AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.