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2027 Masters Thermal Engineering Intern/Co-Op

Advanced Micro Devices
Austin, Texas, United States 12 days ago
AI overview

2027 Masters Thermal Engineering Intern/Co-Op at Advanced Micro Devices in Austin, Texas, United States focuses on From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation. Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward.



ADVANCE YOUR CAREER. ADVANCE THE WORLD. 

At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future. 

Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward. Join us and, together, we’ll advance your career.




As an AMD intern or co-op, you’ll be placed at the epicenter of the AI ecosystem, working alongside experts and industry pioneers. You’ll do important work, learn new skills, expand your network, and gain real-world experience on projects that impact millions of end-users worldwide. Whether you’re an undergrad or a PhD student, your contributions matter—and your experience here will be a launchpad for what comes next.

JOB DETAILS:

  • Location: Santa Clara, CA
  • Onsite/Hybrid: This role requires the student to work full time (40 hours a week), in a hybrid, onsite, or remote work structure throughout the duration of the co-op/internship term.
  • Duration:
    • Spring/Summer Co-op: January 25, 2027 – August 13, 2027
    • Summer Internship
      • Semester Schools: May 24, 2027 – August 13, 2027
      • Quarter Schools: June 21, 2027 – September 10, 2027
    • Summer/Fall Co-op
      • Semester Schools: May 24, 2027 – December 10, 2027
      • Quarter Schools: June 21, 2027 – December 10, 2027

WHAT YOU WILL BE DOING:

We are seeking highly motivated Thermal Engineering intern/co-op to join our teams and support the development of advanced cooling technologies for AI, high-performance computing, and data center platforms. In this role –

  • We will involve you in the thermal and hydraulic characterization of cooling solutions, including cold plates, manifolds, heat exchangers, coolant loops, and rack-level cooling systems.
  • We will provide opportunities for you to evaluate air-cooled and liquid-cooled platforms through thermal, airflow, coolant-flow, and pressure-drop analysis activities.
  • We will train you to support laboratory testing, instrumentation setup, sensor deployment, data acquisition, and thermal validation activities.
  • We will encourage you to develop scripts and tools that automate test execution, data processing, engineering analysis, and reporting activities.
  • We will assign projects involving thermal modeling, simulation, and comparison of measured data against design expectations to help identify trends and support performance improvements.
  • We will have your involvement in investigating thermal, flow, and power-related issues and working with engineering teams to identify effective solutions.
  • We will encourage you to document technical findings and communicate results through engineering reports, presentations, and technical documentation.

WHO WE ARE LOOKING FOR:

  • You are currently enrolled in a U.S.-based university pursuing a Master's degree in Mechanical Engineering, Aerospace Engineering, Thermal Sciences, or a related engineering discipline.
  • If you have knowledge or experience with any of the following technical skills (or related areas) and are enthusiastic about this role, we strongly encourage you to apply –
    • Heat transfer, thermodynamics, fluid mechanics, thermal-fluid systems, or engineering analysis.
    • Thermal management solutions, liquid cooling technologies, electronics cooling concepts, cold plates, heat exchangers, thermal interface materials, airflow management, or coolant flow systems.
    • Laboratory testing, instrumentation, sensors, thermal characterization, data acquisition systems, or experimental validation methodologies.
    • CAD software such as SolidWorks or Creo.
    • CFD software, thermal simulation tools, or engineering analysis software including ANSYS Icepak, Fluent, FloTHERM, COMSOL, OpenFOAM, or similar tools.
    • Analytical, problem-solving, communication, and technical documentation skills.
    • Exposure to AI infrastructure, high-performance computing systems, server technologies, data center platforms, or energy-efficient cooling technologies is a plus.

Note: By submitting your application, you are indicating your interest in AMD Thermal Engineering intern/co-op positions. We are recruiting for multiple positions, and if your experience aligns with any of our opportunities, a recruiter will contact you.

This role is not eligible for visa sponsorship.




Benefits offered are described:  AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position.  AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.

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