Packaging Engineer, Substrate at Advanced Micro Devices in Hsinchu, Taiwan focuses on From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation. Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward.
ADVANCE YOUR CAREER. ADVANCE THE WORLD.
At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.
Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward. Join us and, together, we’ll advance your career.
THE ROLE:
We are seeking a proactive team member for our External Manufacturing Operations (Substrate) team. This role is crucial in ensuring the stable supply of IC substrates for a leading CPU/GPU company. You will be responsible for driving key performance metrics related to NPI projects, supplier readiness, process optimization, and improvements in areas like yield, BCP, and CIP.
THE PERSON:
The successful candidate will be a strong team player with a problem-solving mindset, capable of meeting deadlines in a fast-paced, multitasking environment. You should have excellent communication, project management, and data analysis skills to effectively manage substrate suppliers. Proficiency in English (speaking, writing, and presenting) is essential.
KEY RESPONSIBILITIES:
- Supplier Management:
- Manage substrate supplier from NPI bring up/qualification to production release.
- Substrate supplier’s new production site bring up & qualification.
- Oversee NPI/LVM/HVM yield monitoring, sustaining, and improvements.
- Drive HVM yield attainment and, sustaining issue resolution and prevention through data analytics and corrective actions.
- Lead knowledge-sharing initiatives (Best Known Methods, lessons learned) and drive Continuous Improvement Projects (CIPs).
- Monitor supplier performance using scorecards and lead quarterly technical reviews to ensure improvements.
- Lead projects to drive cross supplier performance improvement/quality enhancement.
- Additional Responsibilities:
- Ad hoc tasks as assigned by the supervisor based on business needs.
PREFERRED EXPERIENCE:
- Experience in IC Substrate industries.
- Technical expertise in FC-BGA, LGA substrate manufacturing, assembly, and test processes.
- Experience in substrate development, from NPI to HVM, is a plus.
- Strong statistical knowledge (DOE, SPC, 6 Sigma) and expertise in data analysis and technical report writing.
- Strong interpersonal communication and teamwork skills.
- Solid time management and project management skills.
ACADEMIC CREDENTIALS:
Bachelor/MS degree in Mechanical or Material or Chemical Engineering
LOCATION:
Hsinchu, Taiwan
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Benefits offered are described: AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.
This posting is for an existing vacancy.